7 SMT Lines; 7 Automatic Printers; 6 AOI Systems - 3D; 7 Reflow Ovens; SPI offline (3D solder paste inspection) 0201, 0402, BGA, LGA, QFN … Assembly; 300.000 Comp./Hour (CHIP IPC)
Manual Assembly; 4 Selective Soldering Machines (RoHS Compliant); 3 Wave Soldering Machines (RoHS Compliant).
Burn In; 3 ICT Checksum; Functional tests, according to Client specifications; ETHERNET, RF Tests; Boundary Scan; Gang-Programming; JTAG; GPS/GSM; X-ray; Thermal Tests chamber.
Placing electronics in metal and plastic boxes; Automatic varnishing; Wiring.
Prototype Assembly; Product optimization, in partnership with the Client.
Problem Diagnosis; Repair; Information back-up.
Component Acquisition (procurement); Project Optimization; Development Support / Project Industrialization.
IPC-A-610 Standard Compliance; IPC 7711&7721 Compliance; Quality management system: IATF 16949:2016 and NP EN ISO 9001:2015. Implementation of NP EN ISO 14001:2015, ISO/IEC 27001 and AS9100; IECEX / ATEX Compliance; ROHS - 2002/95 and 2011/65 Compliance.
Automatic or manual according to customer requirements.